Method of manufacturing surface acoustic wave device

Details Method of manufacturing surface acoustic wave device Method of manufacturing surface acoustic wave device

2008-05-06

2008-05-06

Crispino, Richard (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C310S31300R

Reexamination Certificate

active

07368034

ABSTRACT:
A method of manufacturing a surface acoustic wave device includes interposing a thermosetting adhesive between the insulator that is inserted in the housing portion while the comb-shaped electrodes are directed upward and a bottom portion of the housing portion, and curing the adhesive by heating in a state in which a conductive member is disposed near the opening portion to come in contact with the comb-shaped electrodes, such that the conductive member is separated from the comb-shaped electrodes. Accordingly, a process of forming a conductive film made of carbon and a process of removing the conductive film are not required. Therefore, it is possible to provide a method of manufacturing a surface acoustic wave device that has high productivity and that prevents pyroelectric breakdown between the comb-shaped electrodes at low cost.

REFERENCES:
patent: 9-116364 (1997-05-01), None
patent: 09116364 (1997-05-01), None
patent: 09214271 (1997-08-01), None
Copy of Search Report dated Jun. 7, 2006 for corresponding European Application No. 05014191.0.

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