Method of manufacturing substrates with feedthrough...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S417000, C029S890100, C347S050000, C174S262000, C174S266000

Reexamination Certificate

active

08028407

ABSTRACT:
A method of producing substrate3having feedthrough electrodes for an inkjet head, including: a step of forming grooves in the substrate1in the same pitch as that of the inkjet head; a step of setting conductive member101in the grooves; a step of adhering covering substrate2onto substrate1; a step of cutting adhered substrate1and covering substrate2in a direction perpendicular to that of the grooves in a predetermined width.

REFERENCES:
patent: 4616408 (1986-10-01), Lloyd
patent: 5194877 (1993-03-01), Lam et al.
patent: 7100415 (2006-09-01), Takashima et al.
patent: 7197799 (2007-04-01), Higuchi et al.
patent: 7240433 (2007-07-01), Chung et al.
patent: 7334335 (2008-02-01), Shin et al.
patent: 7478476 (2009-01-01), Kawamura
patent: 2003/0142169 (2003-07-01), Maeng et al.
patent: 2003/0145463 (2003-08-01), Nishikawa et al.
patent: 2003/0150113 (2003-08-01), Ito et al.
patent: 2004/0139608 (2004-07-01), Hostetler
patent: 2005/0110835 (2005-05-01), Ito et al.
patent: 2006/0112554 (2006-06-01), Okuno
patent: 08-058090 (1996-03-01), None
patent: 2004-106458 (2004-04-01), None
patent: 2004-358751 (2004-12-01), None
Japanese Office Action dated May 17, 2011 (3 pages).
English language translation of JP OA dated May 17, 2011 (4 pages).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing substrates with feedthrough... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing substrates with feedthrough..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing substrates with feedthrough... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4261608

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.