Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2008-04-09
2010-11-02
Maldonado, Julio J (Department: 2823)
Semiconductor device manufacturing: process
With measuring or testing
C438S016000, C438S017000, C438S018000, C257S048000, C257SE23179, C257SE21521, C257SE21530, C324S500000
Reexamination Certificate
active
07824930
ABSTRACT:
A method of manufacturing a substrate formed with a plurality of wiring patterns on a base, includes: a first inspection step of identifying a faulty wiring pattern having electric short circuit or disconnection by performing an electric inspection respectively for the plurality of wiring patterns; a second inspection step of examining a relative position of a defect on the base and at least one of a type and a size of the defect by an optical inspection; a matching step of matching a result of the first inspection step with a result of the second inspection step, and identifying a critical defect having electric short circuit or disconnection; and a third inspection step of examining a relative position in a pixel and an effective range of the critical defect by an optical inspection.
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Kawabe Hideo
Koshiishi Ryo
Mukai Nobuhiko
Tsutsui Akiko
K&L Gates LLP
Kim Su C
Maldonado Julio J
Sony Corporation
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