Method of manufacturing sputtering target assembly

Details Method of manufacturing sputtering target assembly Method of manufacturing sputtering target assembly

1991-07-10

1992-09-01

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, 21912114, C23C 1434, B23K 1500

Patent

active

051435900

ABSTRACT:
Described is a method of manufacturing a sputtering target assembly is that minimizes distortion during manufacture and a novel target assembly so produced. The method involves positioning a backing member in an external shoulder formed in the target member, electron beam welding mating surfaces and machining the interior surface of the welded assembly to provide a coextensive surface along the inner surfaces of the target and backing members. The resulting target assembly can withstand high water pressure and high sputter power levels.

REFERENCES:
patent: 4290876 (1981-09-01), Nishiyama et al.
patent: 4341816 (1982-07-01), Lauterbach et al.
patent: 4885075 (1989-12-01), Hillman
patent: 5009765 (1991-04-01), Qamar et al.

Affiliated with

Also associated with

Rating

Method of manufacturing sputtering target assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing sputtering target assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing sputtering target assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-765590