Method of manufacturing solid-state image pickup element,...

Details Method of manufacturing solid-state image pickup element,... Method of manufacturing solid-state image pickup element,...

2011-07-19

2011-07-19

Smoot, Stephen W (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S118000, C438S455000, C257SE21499

Reexamination Certificate

active

07981718

ABSTRACT:
Disclosed herein is a method of manufacturing a solid-state image pickup element, the method including the steps of forming a plurality of photoelectric conversion elements within a semiconductor substrate; forming a wiring layer via an insulating film on a surface of the semiconductor substrate in which surface the plurality of photoelectric conversion elements are formed; laminating a supporting substrate to a surface of the semiconductor substrate in which surface the wiring layer is formed via an adhesive; applying a pressure to the semiconductor substrate and the supporting substrate in a state of the semiconductor substrate and the supporting substrate being laminated to each other via the adhesive; and curing the adhesive by heating the adhesive to a curing temperature of the adhesive after releasing the applied pressure.

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patent: 2005-285988 (2005-10-01), None

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