Method of manufacturing solid-state image pick-up device

Details Method of manufacturing solid-state image pick-up device Method of manufacturing solid-state image pick-up device

1992-12-18

1993-08-24

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 3, 437 4, 358 41, 358 44, H01L 3118

Patent

active

052388565

ABSTRACT:
A method of manufacturing an image pick-up device having at least two photoelectric conversion elements which convert incident light to electric signals. The elements are formed on a semiconductor substrate. A transparent material layer is formed on the substrate so that the elements are covered with the layer. A first thermally deformable resin section is formed at a first location on the layer, the first location corresponding to a location of one of the elements. The first resin section is heated and deformed to be a first condenser lens. After the first resin section is formed, a second thermally deformable resin section is formed at a second location on the layer, the second location corresponding to a location of another of the elements. And the second resin section is heated and deformed to be a second condenser lens so that optical axes of the first and second lenses do not meet each other.

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