Method of manufacturing soldering tips

Metal fusion bonding – Metallic heat applicator – Tip or head alloy or polymetallic structure

Patent

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Details

72 47, B26K 302

Patent

active

045000271

ABSTRACT:
A copper soldering tip with uniform and intact iron protection is manufactured by plating an iron layer of adequate hardness on the surface of a copper substrate to form a tip blank and then shaping the thus formed blank under pressure into a desired final tip configuration. The soldering tip has a uniform erosion resistance and can be produced with ease at a good yield.

REFERENCES:
patent: 2358892 (1944-09-01), Upton
patent: 3125055 (1964-03-01), Lerner
patent: 3662152 (1972-05-01), Weller et al.
patent: 4055744 (1977-10-01), Fortune

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