Method of manufacturing silicon semiconductor acceleration senso

Details Method of manufacturing silicon semiconductor acceleration senso Method of manufacturing silicon semiconductor acceleration senso

1991-09-20

1993-04-13

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437228, 437927, H01L 2172

Patent

active

052022811

ABSTRACT:
A method of manufacturing a semiconductor acceleration includes oxidizing a silicon wafer, removing the oxide film and underlying silicon in a U-shaped pattern at a front surface of the wafer by etching to form a portion that is to become a cantilever, depositing a thin metal film covering the U-shaped pattern that is to become the cantilever, etching a recessed portion in the rear surface of the silicon wafer encompassing the U-shaped pattern, thereby forming the cantilever, dicing the silicon wafer into chips, and removing at least part of the thin metal film, thereby releasing the cantilever.

REFERENCES:
patent: 4670092 (1987-06-01), Motamedi
patent: 4706374 (1987-11-01), Murakami
patent: 4783237 (1988-11-01), Aine et al.
patent: 4836025 (1989-06-01), Mihara
patent: 5060039 (1991-10-01), Weinberg et al.

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