Method of manufacturing shaped hollow bodies

Plastic and nonmetallic article shaping or treating: processes – Gas or vapor deposition of article forming material onto...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

264 83, 427 95, B29c 1304

Patent

active

039432181

ABSTRACT:
A method of producing shaped hollow semiconductor members, as of silicon or silicon carbide by depositing a select semiconductor material from a gaseous compound onto a heated graphite substrate which is first heat-treated above 1300.degree. C. in a flowing gas atmosphere, preferably a mixture of H.sub.2 and SiHCl.sub.3 so as to modify the surface characteristics of the substrate whereby the deposited semiconductor material does not interact with the substrate so that the substrate may be reused.

REFERENCES:
patent: 2925357 (1960-02-01), Kothen
patent: 3329527 (1967-07-01), Harris
patent: 3425878 (1969-02-01), Deisin et al.
patent: 3751539 (1973-08-01), Reuschel et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing shaped hollow bodies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing shaped hollow bodies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing shaped hollow bodies will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-833414

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.