Method of manufacturing semiconductor wafers and process of and

Details Method of manufacturing semiconductor wafers and process of and Method of manufacturing semiconductor wafers and process of and

1996-07-29

1997-12-23

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451190, 451194, B24B 100

Patent

active

057001790

ABSTRACT:
The invention features flattening a sliced wafer in a thin disc-like form, and chamfered if necessary, through simultaneous double side grinding by passing the wafer through between paired cylindrical grinding rolls supported at both ends in bearings, and subsequently single side polishing or double side polishing the flattened wafer to obtain a polished wafer. A lapping step and an etching step in the related art thus can be dispensed with to curtail the process time. The grinding is done by simultaneous double side grinding, so that it is free from slice mark transfer due to vacuum suction of wafer to hold the wafer, or unlike a wax mounting system it does not involve complicated operation. Furthermore, instead of batch grinding, continuous grinding can be readily made. The process is thus free from working stock removal fluctuations and permits high flatness and stable thickness to be obtained by the grinding.

REFERENCES:
patent: 1899463 (1933-02-01), Howard
patent: 2536444 (1951-01-01), Hamilton
patent: 2629899 (1953-03-01), Aller
Abstract of Published Japanese Patent Application No. JP 61-76262.
Abstract of Published Japanese Patent Application No. JP 63-272454.

Affiliated with

Also associated with

Rating

Method of manufacturing semiconductor wafers and process of and does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor wafers and process of and , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor wafers and process of and will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1798465