Method of manufacturing semiconductor wafers

Details Method of manufacturing semiconductor wafers Method of manufacturing semiconductor wafers

1997-01-28

1998-09-01

Nguyen, Nam

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

216 90, 438692, B44C 122, C03C 1500

Patent

active

058007253

ABSTRACT:
A method of manufacturing semiconductor wafers includes a double side primary polishing step, a back side etching step and a single side mirror polishing step. This method is capable of easy sensor detection of the front and back sides of the wafer, wafer processing of higher flatness level by forming etched rough surface at the back side of the double side polished wafer and setting up of wafer manufacturing process including a double side polishing step.

REFERENCES:
patent: 5071776 (1991-12-01), Matsushita et al.
patent: 5424224 (1995-06-01), Allen et al.

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