Method of manufacturing semiconductor wafer and system therefor

Details Method of manufacturing semiconductor wafer and system therefor Method of manufacturing semiconductor wafer and system therefor

1993-12-16

1995-06-27

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, 125 1302, 437 8, 437225, 437249, 437947, B32B 3500

Patent

active

054276446

ABSTRACT:
An ingot is conveyed to a slicing machine by an ingot loader. Then, the ingot is cut into a wafer by the slicing machine. And, the cut wafer is conveyed to a peel-off portion and soaked in a warm water tank for a predetermined time so that the adhesive of the slice base can be heat softened, and then the slice base is hammered by a hammer rod so as to be peeled off from the wafer. Further, the wafer, from which the slice base has been peeled off, is conveyed to a wash-dry device, and washed and dried. The washed and dried wafer is conveyed to a surface inspecting device by a conveying device and judged a pass or fail to the wafer standard in the surface inspecting device. And, the passed wafer is conveyed to a chamfering device and the edge of the wafer is chamfered by the chamfering device. Then, the chamfered wafer is washed and dried by a wash-dry device, thereafter, conveyed to the storing part by the conveying device and stored.

REFERENCES:
patent: 4390392 (1983-06-01), Robinson et al.
patent: 4420909 (1983-12-01), Steere, Jr.
patent: 4599558 (1986-07-01), Castellano, Jr.
patent: 5227339 (1993-07-01), Kishii
patent: 5329733 (1994-07-01), Steere, Jr.

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