Single-crystal – oriented-crystal – and epitaxy growth processes; – Processes of growth with a subsequent step of heat treating...
Reexamination Certificate
2005-05-10
2005-05-10
Pert, Evan (Department: 2829)
Single-crystal, oriented-crystal, and epitaxy growth processes;
Processes of growth with a subsequent step of heat treating...
C438S795000
Reexamination Certificate
active
06890383
ABSTRACT:
A semiconductor wafer manufacturing method comprising mounting a single crystal silicon wafer (W) in a pocket (11) arranged in a susceptor (10), and performing heat treatment for the single crystal silicon wafer (W) to manufacture a semiconductor wafer, wherein a contact ratio of the pocket (11) with the single crystal silicon wafer (W) is set to 0.1% or more and 1.1% or less.
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Geyer Scott B.
Pert Evan
Shin-Etsu Handotai & Co., Ltd.
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