Method of manufacturing semiconductor wafer and susceptor...

Single-crystal – oriented-crystal – and epitaxy growth processes; – Processes of growth with a subsequent step of heat treating...

Reexamination Certificate

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C438S795000

Reexamination Certificate

active

06890383

ABSTRACT:
A semiconductor wafer manufacturing method comprising mounting a single crystal silicon wafer (W) in a pocket (11) arranged in a susceptor (10), and performing heat treatment for the single crystal silicon wafer (W) to manufacture a semiconductor wafer, wherein a contact ratio of the pocket (11) with the single crystal silicon wafer (W) is set to 0.1% or more and 1.1% or less.

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patent: A 8-70034 (1996-03-01), None

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