Method of manufacturing semiconductor wafer

Details Method of manufacturing semiconductor wafer Method of manufacturing semiconductor wafer

1997-05-19

2000-06-27

Niebling, John F.

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

438458, 438691, 438692, 438974, H01L 2130, H01L 2146

Patent

active

060806419

ABSTRACT:
There is disclosed a method of manufacturing semiconductor wafers, in which a lapping process is performed prior to a chamfering process. This makes it possible to manufacture semiconductor wafers while maintaining the smoothness and dimensional accuracy of a chamfered surface of each wafer obtained by the chamfering process.

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