Method of manufacturing semiconductor substrate

Details Method of manufacturing semiconductor substrate Method of manufacturing semiconductor substrate

1985-02-14

1987-01-27

Saba, William G.

Metal working

Method of mechanical manufacture

Assembling or joining

29576W, 29580, 65 593, 148175, 148DIG12, 148DIG159, 1562739, 357 49, 357 50, 357 55, H01L 21302, H01L 2176

Patent

active

046385525

ABSTRACT:
A method of manufacturing a semiconductor substrate having a modified layer therein comprises the steps of mirror-polishing one surface of each of first and second semiconductor plates, forming a modified layer on at least one of the polished surfaces of the first and second semiconductor plates, and bonding the polished surfaces of the first and second semiconductor plates with each other in a clean atmosphere.

REFERENCES:
patent: 3239908 (1966-03-01), Nakamura
patent: 3332137 (1967-07-01), Kenney
patent: 3355636 (1967-11-01), Becke et al.
patent: 4103273 (1978-07-01), Keller
patent: 4169000 (1979-09-01), Riseman
patent: 4291293 (1981-09-01), Yamada et al.
patent: 4317091 (1982-02-01), Dahlberg
patent: 4426768 (1984-01-01), Black et al.
patent: 4441115 (1984-04-01), Dahlberg
patent: 4501060 (1985-02-01), Frye et al.

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