Method of manufacturing semiconductor substrate

Details Method of manufacturing semiconductor substrate Method of manufacturing semiconductor substrate

1990-12-03

1992-02-11

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156153, 156257, 156155, 51283E, 51323, B32B 3114

Patent

active

050873075

ABSTRACT:
A method of manufacturing a semiconductor substrate comprises a first step of preparing one hundred silicon bodies each having two silicon wafers held together by cohesion after polishing and heating processes. The method further comprises a second step of stacking the silicon bodies in their thickness direction to form a stacked body, and a third step of cylindrically grinding the side surface of the stacked body by a predetermined amount.

REFERENCES:
patent: 369074 (1887-08-01), Pearce et al.
patent: 3355636 (1967-11-01), Becke et al.
patent: 3475867 (1969-11-01), Walsh
patent: 3503125 (1970-03-01), Haberecht
patent: 3567547 (1971-03-01), Mattson et al.
patent: 4331452 (1982-05-01), Causey et al.

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