Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2005-05-03
2005-05-03
Cao, Phat X. (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S113000, C438S124000
Reexamination Certificate
active
06887739
ABSTRACT:
In a method of forming a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.
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Fujisawa Atsushi
Haruta Ryo
Ichitani Masahiro
Konno Takafumi
Ohsaka Shingo
Antonelli Terry Stout & Kraus LLP
Cao Phat X.
Hitachi Hokkai Semiconductor Ltd.
Renesas Technology Corp.
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