Method of manufacturing semiconductor memory device

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01L 2120

Patent

active

058888780

ABSTRACT:
A storage node electrode formed of doped amorphous silicon is provided on a silicon substrate. Silicon crystal grains are formed on the surface of the storage node electrode by annealing it in the atmosphere including PH.sub.3. A capacitor insulating film and a cell plate electrode are formed to cover the surface of the storage node electrode including silicon crystal grains. Larger silicon crystal grains are accordingly provided on the surface of the storage node electrode, resulting in increased capacitance of the capacitor.

REFERENCES:
patent: 4826779 (1989-05-01), Wright et al.
patent: 5612558 (1997-03-01), Harshfield
patent: 5623243 (1997-04-01), Watanabe et al.
Applied Physics, vol. 61, No. 11, pp. 1147-1151.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing semiconductor memory device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor memory device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor memory device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1214398

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.