Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Passivating of surface
Reexamination Certificate
2009-11-09
2011-12-06
Luu, Chuong A (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Passivating of surface
C438S022000, C257SE33005
Reexamination Certificate
active
08071408
ABSTRACT:
A method includes steps of: sequentially growing a first semiconductor layer of a first conductivity type, an active layer, and a second semiconductor layer of a second conductivity type on a growth substrate to form a layered structure; separating the substrate from the layered structure to expose the first layer; performing wet etching on an exposed surface to form defect depressions; forming an insulating layer on the exposed surface; polishing the insulating layer and the first layer to flatten the surface of the first layer; and performing wet etching on the surface of the first layer to form protrusions deriving from a crystal structure.
REFERENCES:
patent: 2005/0156189 (2005-07-01), Deguchi et al.
patent: 2009/0294784 (2009-12-01), Nakahara et al.
patent: 2007-088404 (2007-04-01), None
patent: 2007-165409 (2007-06-01), None
Tanaka Satoshi
Yokobayashi Yusuke
Doan Nga
Holtz Holtz Goodman & Chick PC
Luu Chuong A
Stanley Electric Co. Ltd.
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