Method of manufacturing semiconductor element, and...

Details Method of manufacturing semiconductor element, and... Method of manufacturing semiconductor element, and...

2005-07-26

2005-07-26

Schillinger, Laura M (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Substrate dicing

C438S038000, C438S029000

Reexamination Certificate

active

06921677

ABSTRACT:
When manufacturing semiconductor elements, a group of semiconductor elements having a diffraction grating formed partly on the side of the facet from which laser light is emitted is formed collectively on a semiconductor wafer by using semiconductor process technologies. The semiconductor laser elements are arranged such that the light emitting facets are opposite to each other to thereby form each diffraction grating of the semiconductor laser elements arranged opposite to each other as one diffraction grating, cleaving this diffraction grating at respective cleavage planes to cut out laser bars, followed by the cleavage of cleavage planes to cut out semiconductor laser elements.

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