Method of manufacturing semiconductor diodes for use in millimet

Details Method of manufacturing semiconductor diodes for use in millimet Method of manufacturing semiconductor diodes for use in millimet

1976-03-05

1977-05-17

Drummond, Douglas J.

Metal working

Method of mechanical manufacture

Assembling or joining

29583, 29590, 29591, 156645, 156659, 357 55, 357 65, B01J 1700, H01L 21302

Patent

active

040232581

ABSTRACT:
A new method of semiconductor diode processing is described in which the resulting diode chips have an ohmic contact on four side faces of the chip. This is accomplished by cutting notches in the back side of a semiconductor slice before processing and by breaking the slice along the notches after fabricating the diodes on the front side of the slice. The new diode chip has a smaller series resistance than conventional millimeter-wave structures, and it can be readily bonded or soldered to millimeter-wave thin film circuits.

REFERENCES:
patent: 3151007 (1964-09-01), Dahlberg
patent: 3670404 (1972-06-01), Kamoshida
patent: 3775200 (1973-11-01), DE Nobel et al.
patent: 3781975 (1974-01-01), Ressel et al.
patent: 3897627 (1975-08-01), Klatskin
patent: 3962713 (1976-06-01), Kendall et al.
patent: 3972113 (1976-08-01), Nakata et al.

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