Method of manufacturing semiconductor devices with local oxidati

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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29576R, 29578, 29580, 148187, 357 49, 357 50, 357 86, 357 88, H01L 2176, H01L 2704

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active

040081079

ABSTRACT:
An improved method of manufacturing a semiconductor device employs a local oxidation process in which an oxide isolation region is formed by locally oxidizing a silicon epitaxial layer, using a nitride-oxide double layer for masking purposes, with a P.sup.+ type region being formed by the diffusion of an impurity into the silicon epitaxial layer using the oxide isolation region, which has an "oxide beak", as a diffusion mask. An additional region of the same conductivity type as the P.sup.+ type diffused region is provided to be contiguous to the P.sup.+ type diffused region, so that a PN junction terminates at a silicon surface remote from the electrode to be connected to the P.sup.+ diffused region.
As a result, disadvantages caused by the oxide beak, such as the imperfect protection of the PN junction and short-circuiting between the electrode and the epitaxial layer through pin holes in the oxide beak can be eliminated.

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