Method of manufacturing semiconductor devices utilizing epitaxia

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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29576W, 29578, 148187, 148190, 357 34, 357 44, 357 46, 357 48, 357 89, 357 90, H01L 2120, H01L 2122

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042395585

ABSTRACT:
A method of manufacturing a semiconductor device having at least one power transistor and a plurality of small signal transistors formed on the same semiconductor substrate is disclosed. First, a base region of the power transistor and an isolating region are formed by diffusion simultaneously in an epitaxial layer on the semiconductor substrate. Second, an emitter region of the power transistor and the collector regions of the small signal transistors are simultaneously formed by diffusion, and finally the bases, and emitters of the small signal transistors are formed in succession by diffusion.

REFERENCES:
patent: 3309537 (1967-03-01), Archer
patent: 3391035 (1968-07-01), Mackintosh
patent: 3453505 (1969-07-01), Offner et al.
patent: 3518494 (1970-06-01), James
patent: 3596115 (1971-07-01), Conzelmann
patent: 3981072 (1976-09-01), Buie
patent: 3982269 (1976-09-01), Torreno et al.
patent: 4038680 (1977-07-01), Yagi et al.
patent: 4047220 (1977-09-01), Ferro et al.

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