Method of manufacturing semiconductor devices using a bond...

Details Method of manufacturing semiconductor devices using a bond... Method of manufacturing semiconductor devices using a bond...

2006-04-18

2006-04-18

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Optical characteristic sensed

C438S016000, C438S617000, C716S030000

Reexamination Certificate

active

07029929

ABSTRACT:
A method for checking a wire bonding recipe is provided. Generally, coordinate data of a master recipe is stored. Coordinate data of a slave recipe is stored. The coordinate data of the slave recipe is compared with coordinate data of the master recipe. An error signal is provided if a mismatch is found between the coordinate data of the slave recipe and the coordinate data of the master recipe.A computer readable medium containing program instructions for checking a wire bonding recipe is also provided. The program contains computer readable code for storing coordinate data of a master recipe, computer readable code for storing coordinate data of a slave recipe, computer readable code for comparing the coordinate data of the slave recipe with coordinate data of the master recipe, and computer readable code for providing an error signal if a mismatch is found between the coordinate data of the slave recipe and the coordinate data of the master recipe.

REFERENCES:
patent: 4010885 (1977-03-01), Keizer et al.
patent: 4953006 (1990-08-01), Kovats
patent: 5007097 (1991-04-01), Mizuoka et al.
patent: 5012673 (1991-05-01), Takano et al.
patent: 5119436 (1992-06-01), Holdgrafer
patent: 5549716 (1996-08-01), Takahashi et al.
patent: 5757956 (1998-05-01), Koljonen et al.
patent: 6054767 (2000-04-01), Chia et al.
patent: 6516447 (2003-02-01), Wadland et al.
patent: 6538898 (2003-03-01), Prindivill et al.
patent: 6555401 (2003-04-01), Koduri
patent: 2001/0006041 (2001-07-01), Wensel
patent: 2003/0192019 (2003-10-01), Goto et al.

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