Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal
Patent
1979-08-31
1980-11-11
Rutledge, L. Dewayne
Metal treatment
Process of modifying or maintaining internal physical...
Chemical-heat removing or burning of metal
29574, 29576W, 29578, 29580, 148 15, 148174, 156626, 156647, 156649, 156653, 156657, 156662, 357 49, 357 50, 357 54, 357 56, 357 59, H01L 2120, H01L 21302, H01L 2176
Patent
active
042330912
ABSTRACT:
A semiconductor device comprises a V-groove isolation structure and an alignment mark having a sharp contour. The alignment mark consists of a locally thick portion of an oxide layer covering an epitaxial layer in which a V-groove is formed. The alignment mark is produced by a thermal oxidizing operation involved in the manufacturing procedure of the V-groove isolation structure.
REFERENCES:
patent: 3783044 (1974-01-01), Cheskis et al.
patent: 3847687 (1974-11-01), Davidsohn
patent: 3883948 (1975-05-01), Allison
patent: 3892608 (1975-07-01), Kuhn
patent: 3911562 (1975-10-01), Youmans
patent: 3956033 (1976-05-01), Roberson
patent: 3966501 (1976-06-01), Nomura et al.
patent: 3979237 (1976-09-01), Morcom et al.
patent: 3998673 (1976-12-01), Chow
patent: 4125418 (1978-11-01), Vinton
Fields, S. W., "The Great Bipolar Ram Race", Electronics, Jul. 3, 1972, pp. 65-66.
Fujitsu Limited
Rutledge L. Dewayne
Saba W. G.
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