Method of manufacturing semiconductor devices having improved al

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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29574, 29576W, 29578, 29580, 148 15, 148174, 156626, 156647, 156649, 156653, 156657, 156662, 357 49, 357 50, 357 54, 357 56, 357 59, H01L 2120, H01L 21302, H01L 2176

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042330912

ABSTRACT:
A semiconductor device comprises a V-groove isolation structure and an alignment mark having a sharp contour. The alignment mark consists of a locally thick portion of an oxide layer covering an epitaxial layer in which a V-groove is formed. The alignment mark is produced by a thermal oxidizing operation involved in the manufacturing procedure of the V-groove isolation structure.

REFERENCES:
patent: 3783044 (1974-01-01), Cheskis et al.
patent: 3847687 (1974-11-01), Davidsohn
patent: 3883948 (1975-05-01), Allison
patent: 3892608 (1975-07-01), Kuhn
patent: 3911562 (1975-10-01), Youmans
patent: 3956033 (1976-05-01), Roberson
patent: 3966501 (1976-06-01), Nomura et al.
patent: 3979237 (1976-09-01), Morcom et al.
patent: 3998673 (1976-12-01), Chow
patent: 4125418 (1978-11-01), Vinton
Fields, S. W., "The Great Bipolar Ram Race", Electronics, Jul. 3, 1972, pp. 65-66.

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