Method of manufacturing semiconductor devices, and leadframe and

Details Method of manufacturing semiconductor devices, and leadframe and Method of manufacturing semiconductor devices, and leadframe and

1990-12-11

1991-11-26

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437206, H01L 2348

Patent

active

050682067

ABSTRACT:
The present invention proposes a method of manufacturing semiconductor devices from an elongated leadframe by using a differential overlapping apparatus. The leadframe has longitudinally spaced pairs of staggered leads. The overlapping apparatus functions to deform the leadframe during transfer thereof, so that each pair of staggered leads assumes the same longitudinal position but displaced away from each other perpendicularly to a plane containing the leadframe. The leadframe is further deformed to cuase the pair of leads to move toward each other, so that a semicondductor chip is sandwiched between the pair of leads for bonding.

REFERENCES:
patent: 3430115 (1969-02-01), Webb
patent: 3839782 (1974-10-01), Lincoln
patent: 4616250 (1986-10-01), Folk

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