Method of manufacturing semiconductor devices, and leadframe and

Details Method of manufacturing semiconductor devices, and leadframe and Method of manufacturing semiconductor devices, and leadframe and

1989-07-11

1991-08-13

Chaudhuri, Olik

Metal working

Barrier layer or semiconductor device making

29827, 437206, 437220, 439885, H01L 2348

Patent

active

050384538

ABSTRACT:
The present invention proposes a method of manufacturing semiconductor devices from an elongated leadframe by using a differential overlapping apparatus. The leadframe has longitudinally spaced pairs of staggered leads. The overlapping apparatus functions to deform the leadframe during transfer thereof, so that each pair of staggered leads assumes the same longitudinal position but displaced away from each other perpendicularly to a plane containing the leadframe. The leadframe is further deformed to cause the pair of leads to move toward each other, so that a semiconductor chip is sandwiched between the pair of leads for bonding.

REFERENCES:
patent: Re29906 (1979-02-01), Jackson
patent: 3698076 (1972-10-01), Kingsley
patent: 3859718 (1975-01-01), Noe
patent: 4069924 (1978-01-01), McCockle
patent: 4252864 (1981-02-01), Coldren
patent: 4616250 (1986-10-01), Folk
patent: 4850103 (1989-07-01), Takemoto et al.
patent: 4859632 (1989-08-01), Lumbard

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