Method of manufacturing semiconductor devices

Details Method of manufacturing semiconductor devices Method of manufacturing semiconductor devices

1975-01-02

1976-01-27

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29590, 357 90, B01J 1700

Patent

active

039343316

ABSTRACT:
A method of manufacturing semiconductor devices comprising a semiconductor element having a PN junction in which an N.sup.+-type region is formed in an N-type region constituting the PN junction and another N-type region is formed around the N.sup.+-type region and a metal layer is provided on the other N-type region and the N.sup.+-type region, thereby providing a mechanically and electrically improved ohmic contact to the semiconductor element.

REFERENCES:
patent: 380805 (1974-04-01), Henning
patent: 3343255 (1967-09-01), Donovan
patent: 3360696 (1967-12-01), Neilson
patent: 3542266 (1970-11-01), Woelfle
patent: 3608186 (1971-09-01), Hutson

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