Fishing – trapping – and vermin destroying
Patent
1992-01-24
1993-10-05
Kunemund, Robert
Fishing, trapping, and vermin destroying
437159, 437174, H01L 2126, H01L 21306
Patent
active
052504654
ABSTRACT:
A semiconductor device having small diameter via-holes, particularly not greater than 0.6 microns, for a multilayer interconnection is produced by a method comprising covering an interlayer film and via-holes with a continuous, first metal film by a CVD process, and heating and melting by an irradiation of an energy beam a second metal film deposited on the first film by a PVD process, together with the first metal film, to fully fill the via-holes with the material from the outside of the holes, to thus form conductive plugs therein. The deposition of the material of the second metal film and the filling of the via-holes may be simultaneously performed by a high temperature sputtering process.
REFERENCES:
patent: 4826785 (1989-05-01), McClure et al.
patent: 4968643 (1990-11-01), Mukai
patent: 4970176 (1990-11-01), Tracy et al.
patent: 5032233 (1991-07-01), Yu et al.
patent: 5110759 (1992-05-01), Mukai
Patent Abstracts of Japan, vol. 12, No. 265 (E-637) 23 Jul. 1988 & JP-A-63 048841 dated Mar. 1, 1988.
W. Spiess et al., "Via hole filling with gold melting by KrF excimer laser irradiation," Journal of Vacuum Science and Technology: Part B, vol. 7, No. 1 Feb. 1989, New York, N.Y., pp. 127-128.
Iizuka Masako
Mukai Ryoichi
Nakano Moto'o
Fujitsu Limited
Kunemund Robert
Trinh Loc Q.
LandOfFree
Method of manufacturing semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1003445