Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-08-23
2011-10-18
Fahmy, Wael (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S125000, C438S126000
Reexamination Certificate
active
08039310
ABSTRACT:
A semiconductor method comprises a method for making a device comprising: a base; a semiconductor chip provided on the base which includes a first main surface20aon which a plurality of electrode pads is provided, a surface protecting film provided on the first main surface, a second main surface which opposes the first main surface, and a plurality of side surfaces between the surface of the surface protecting film and the second main surface; an insulating extension portion formed so as to surround the side surfaces of the semiconductor chip; a plurality of wiring patterns electrically connected to the electrode pads, respectively and extended from the electrode pads to the surface of the extension portion; a sealing portion formed on the wiring patterns such that a part of each of the wiring patterns is exposed; and a plurality of external terminals provided on the wiring patterns in a region including the upper side of the extension portion.
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Fahmy Wael
Kalam Abul
Oki Semiconductor Co., Ltd.
Rabin & Berdo PC
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