Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2005-05-10
2005-05-10
Lee, Eddie (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S110000
Reexamination Certificate
active
06890800
ABSTRACT:
One side of a ceramic multilayer board is attached to a resin film with adhesive, the resin film is mounted on a mold for resin sealing having a cavity provided in desired position, the position of the board is controlled by pressing against a portion of the resin film by a portion of the mold for sealing, and thereafter sealing is conducted by filling an epoxy resin into the cavity. The thus prepared semiconductor device has a rear face on which electrodes for connecting to outside are exposed, and the sealing resin is formed so as to be flush with respect to the rear face of the board, surround the periphery of the board, and form a cross section in a rectangular shape. With this configuration, the semiconductor device free from a crack can be sealed with resin.
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Takehara Hideki
Tsumura Susumu
Yoshikawa Noriyuki
Lee Eddie
Matsushita Electric - Industrial Co., Ltd.
Merchant & Gould P.C.
Owens Douglas W.
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