Method of manufacturing semiconductor device using dry photoresi

Details Method of manufacturing semiconductor device using dry photoresi Method of manufacturing semiconductor device using dry photoresi

1999-12-10

2000-10-31

Quach, T. N.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438613, 438614, 438678, H01L 2450

Patent

active

061401552

ABSTRACT:
A plating tray includes a recessed region in a central portion of an insulating substrate for arranging therein a silicon semiconductor substrate and a metal film arranged to surround the recessed region. The semiconductor substrate is housed in the recessed region. Under this condition, a dry photoresist film containing Na, K, Ca and Cu in amounts smaller than predetermined amounts is formed to cover a metal underlying film. Then, a projecting electrode is formed by electroplating within open portions formed in the resist film. In forming the projecting electrode, the open portion is also formed in that region of the resist film which corresponds to the metal film of the plating plate so as to form a dummy projection electrode simultaneously.

REFERENCES:
patent: 4159222 (1979-06-01), Lebow et al.
patent: 5198385 (1993-03-01), Devitt et al.
patent: 5202151 (1993-04-01), Ushio et al.
patent: 5664325 (1997-09-01), Fukotomi et al.
patent: 5719439 (1998-02-01), Iwasaki et al.

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