Method of manufacturing semiconductor device, semiconductor...

Details Method of manufacturing semiconductor device, semiconductor... Method of manufacturing semiconductor device, semiconductor...

2007-10-16

2007-10-16

Kim, Robert (Department: 2881)

Radiant energy

Irradiation of objects or material

Irradiation of semiconductor devices

C250S492230, C250S492200, C250S3960ML

Reexamination Certificate

active

11284035

ABSTRACT:
A manufacturing apparatus of a semiconductor device is disclosed, which comprises an implantation source which applies particles or an electromagnetic wave into an implantation region of a semiconductor substrate in a θ direction shifted by an angle θ from a vertical direction of the semiconductor substrate, a first stencil mask disposed between the semiconductor substrate and the implantation source, the first stencil mask having a first opening corresponding in the θ direction to the implantation region, and a second stencil mask disposed between the first stencil mask and the implantation source, the second stencil mask having a second opening corresponding in the θ direction to the implantation region.

REFERENCES:
patent: 4524278 (1985-06-01), Le Poole
patent: 4560878 (1985-12-01), Knauer et al.
patent: 5838058 (1998-11-01), Kitajima et al.
patent: 6214498 (2001-04-01), Choi
patent: 2002/0058400 (2002-05-01), Suguro et al.
patent: 49-68660 (1974-07-01), None
patent: 2002-203806 (2002-07-01), None
patent: 2002-237447 (2002-08-01), None
patent: WO 02/052662 (2002-07-01), None

Affiliated with

Also associated with

Rating

Method of manufacturing semiconductor device, semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor device, semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor device, semiconductor... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3826093