Method of manufacturing semiconductor device, mask and...

Details Method of manufacturing semiconductor device, mask and... Method of manufacturing semiconductor device, mask and...

2011-01-25

2011-01-25

Young, Christopher G (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

C430S030000, C430S312000, C430S328000

Reexamination Certificate

active

07875409

ABSTRACT:
A method of manufacturing a semiconductor device answerable to refinement of circuits by correctly connecting adjacent small patterns with each other with excellent reproducibility in connective exposure and a semiconductor device manufactured by this method are proposed. According to this method of manufacturing a semiconductor device, connective exposure is performed by dividing a pattern formed on a semiconductor substrate into a plurality of patterns and exposing the plurality of divided patterns in a connective manner, by forming marks for adjusting arrangement of the patterns to be connected with each other on the semiconductor substrate before exposing patterns of a semiconductor element and connectively exposing the patterns of the semiconductor element in coincidence with the marks for adjusting arrangement.

REFERENCES:
patent: 6194105 (2001-02-01), Shacham et al.
patent: 6225013 (2001-05-01), Cohen et al.
patent: 2-5568 (1990-01-01), None

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