Method of manufacturing semiconductor device having trapezoidal

Details Method of manufacturing semiconductor device having trapezoidal Method of manufacturing semiconductor device having trapezoidal

1986-12-03

1989-06-13

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437227, H01L 21463

Patent

active

048393002

ABSTRACT:
A method for manufacturing a semiconductor device using inclined stage of a dicing saw in order to cut the semiconductor substrate obliquely with respect to the depthwise direction. When a plurality of semiconductor chips diced obliquely are connected, a degree of connecting accuracy is increased, and it is possible to realize a contact-type image sensor of high resolving power and high accuracy.

REFERENCES:
patent: 3078559 (1963-02-01), Thomas
patent: 4138304 (1979-02-01), Gantley

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