Method of manufacturing semiconductor device having plural...

Details Method of manufacturing semiconductor device having plural... Method of manufacturing semiconductor device having plural...

2011-07-26

2011-07-26

Mai, Anh D (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S112000, C438S465000, C257SE21502

Reexamination Certificate

active

07985624

ABSTRACT:
Provided is a method of manufacturing a semiconductor device including: arranging multiple dies planarly between a first lead frame plate and a second lead frame plate, which face each other, to connect the multiple semiconductor chips to each of the first lead frame plate and the second lead frame plate; filling a resin between the first lead frame plate and the second lead frame plate to seal the multiple dies; performing a first dicing on a laminated body including the first lead frame plate, the resin, and the second lead frame plate, between the adjacent dies, to separate at least the first lead frame plate by cutting; applying plating to the laminated body with at least the first lead frame plate being separated by cutting; and performing a second dicing on a remainder of the laminated body between the adjacent dies, to separate the laminated body into individual semiconductor devices.

REFERENCES:
patent: 6291317 (2001-09-01), Salatino et al.
patent: 7187060 (2007-03-01), Usui
patent: 7224045 (2007-05-01), Tabira et al.
patent: 7576415 (2009-08-01), Cha et al.
patent: 2007/0062637 (2007-03-01), Sjoedin
patent: 2007/0235774 (2007-10-01), Zandman et al.
patent: 2005-51130 (2005-02-01), None

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