Method of manufacturing semiconductor device employing oxide sid

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 44, 437 48, 437 52, 437228, 437229, 437984, 148DIG111, H01L 21336

Patent

active

053669134

ABSTRACT:
When a semiconductor is manufactured by a resist mask process while using photolithography techniques, the gate wiring width is increased without increasing the cell area by providing a sidewall on the gate mask and using the sidewall as a mask. The sidewall is produced by applying a CVD oxide film to the mask and removing the oxide film by anisotropic etching. This provides a minimum gate line width of 0.7.mu. and a minimum space width of 0.3.mu..

REFERENCES:
patent: 4792534 (1988-12-01), Tsuji et al.
patent: 5017515 (1991-05-01), Gill
patent: 5094971 (1992-03-01), Kanebako
patent: 5114872 (1992-05-01), Roselle et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing semiconductor device employing oxide sid does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor device employing oxide sid, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor device employing oxide sid will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1991127

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.