Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-05-16
2006-05-16
Lee, Hsien-Ming (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S114000, C438S460000, C438S465000
Reexamination Certificate
active
07045394
ABSTRACT:
A method of manufacturing a semiconductor device is provided. A semiconductor module is prepared which has a wiring board and a plurality of semiconductor chips mounted on a first face of the wiring board. The semiconductor chips overlap a central region of the wiring board and an edge region of the wiring board surround the central region. An adhesive tape is located opposite the first face of the wiring board, followed by sticking the adhesive tape to the semiconductor module by a roller. Thereafter, the resulting semiconductor module is cut from a second face side of the wiring board to yield the device. The roller has a central portion and two end portions. The central portion presses the adhesive tape from above the central region. The end portions press the adhesive tape from above the two end regions.
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Aoyagi Akiyoshi
Sato Shiro
Harness & Dickey & Pierce P.L.C.
Lee Hsien-Ming
Seiko Epson Corporation
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