Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-01-17
2009-10-27
Le, Thao X (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C257SE23069
Reexamination Certificate
active
07608479
ABSTRACT:
A method of manufacturing a semiconductor device includes: applying a paste containing acid to an electrical connection section which is electrically connected with a semiconductor substrate; removing the paste from the electrical connection section by washing the electrical connection section; and providing a conductive material to the electrical connection section.
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Nakayama Hirohisa
Nosaka Hitoshi
Sato Shiro
Shoji Masanobu
Le Thao X
Oliff & Berridg,e PLC
Seiko Epson Corporation
Ullah Elias
LandOfFree
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