Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-06-05
2007-06-05
Smith, Zandra V. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S107000, C438S109000, C438S118000, C438S119000
Reexamination Certificate
active
10833947
ABSTRACT:
A method of manufacturing a semiconductor device includes providing resin on at least a partial area on a first semiconductor package and coupling a second semiconductor package to the first semiconductor package electrically while the resin maintains its fluidity.
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Au Bac H.
Hogan & Hartson LLP
Seiko Epson Corporation
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