Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2005-01-11
2005-01-11
Pert, Evan (Department: 2829)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C435S091500
Reexamination Certificate
active
06841487
ABSTRACT:
A semiconductor manufacturing method is mainly contemplated, improved to prevent an altered surface layer of a resist from being removed when a single patterned resist is used to provide dry-etch and wet-etch successively. On a semiconductor substrate an insulation film and a conductive layer are formed successively. On the conductive layer a patterned resist is formed. With the patterned resist used as a mask, the conductive layer is dry-etched. A surface layer of the patterned resist is partially removed. With the patterned resist used as a mask, the insulation film is wet-etched.
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Shimizu Shu
Tanaka Tamotsu
Yano Takashi
Yuzuriha Kojiro
Kilday Lisa
McDermott Will & Emery LLP
Pert Evan
Renesas Technology Corp.
Ryoden Semiconductor System Engineering Corporation
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