Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With measuring – sensing – detection or process control means
Reexamination Certificate
2009-11-10
2010-12-14
Monbleau, Davienne (Department: 2893)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With measuring, sensing, detection or process control means
C156S345150, C156S345170, C156S345210, C156S345240, C156S345250, C156S345270, C156S345550, C134S095100, C134S099100, C134S113000, C134S153000, C134S902000, C438S017000
Reexamination Certificate
active
07850818
ABSTRACT:
The disclosure concerns a manufacturing method of a semiconductor device includes dry-etching a semiconductor substrate or a structure formed on the semiconductor substrate; supplying a solution onto the semiconductor substrate; measuring a specific resistance or a conductivity of the supplied solution; and supplying a removal solution for removing the etching residual material onto the semiconductor substrate for a predetermined period of time based on the specific resistance or the conductivity of the solution, when an etching residual material adhering to the semiconductor substrate or the structure is removed.
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Notification of Reasons for Rejection issued by the Japanese Patent Office on May 28, 2010, for Japanese Patent Application No. 2006-021024, and English-language translation thereof.
Matsumura Tsuyoshi
Miyazaki Kunihiro
Uozumi Yoshihiro
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
Khan Farid
Monbleau Davienne
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