Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2007-07-17
2007-07-17
Wilczewski, M. (Department: 2822)
Semiconductor device manufacturing: process
With measuring or testing
C355S053000, C355S067000, C356S399000, C356S614000, C430S022000
Reexamination Certificate
active
10372867
ABSTRACT:
A method of manufacturing a semiconductor device and an apparatus of automatically adjusting a semiconductor pattern can precisely correct a difference in the shape or position of a pattern exposed or formed in two exposure steps. A pattern measuring unit measures an offset between the first pattern and the second pattern in a pattern measuring step. Based on the information on the offset thus detected, the first pattern is adjusted in a first patterning step with a high degree of freedom in the next manufacturing step cycle of a semiconductor device to precisely align the shape or position of the first pattern with the second pattern in a second patterning step with a low degree of freedom.
REFERENCES:
patent: 4500790 (1985-02-01), Bretscher et al.
patent: 5684565 (1997-11-01), Oshida et al.
patent: 5780188 (1998-07-01), Rolson
patent: 5877861 (1999-03-01), Ausschnitt et al.
patent: 6245470 (2001-06-01), Kamon
patent: 6359678 (2002-03-01), Ota
patent: 6366341 (2002-04-01), Shirato et al.
patent: 6445453 (2002-09-01), Hill
patent: 6493065 (2002-12-01), Ina et al.
patent: 6538721 (2003-03-01), Okita et al.
patent: 6731376 (2004-05-01), Markle
patent: 6757066 (2004-06-01), Hill
patent: 6762845 (2004-07-01), Hill
patent: 6894763 (2005-05-01), Murakami et al.
patent: 6900880 (2005-05-01), Kida et al.
patent: 6906784 (2005-06-01), Hill
patent: 6912054 (2005-06-01), Hill
patent: 6924896 (2005-08-01), Hill
patent: 6969966 (2005-11-01), Ebihara et al.
patent: 7038762 (2006-05-01), Boettiger et al.
patent: 7057736 (2006-06-01), Hill
patent: 7057746 (2006-06-01), Binnig et al.
patent: 7068350 (2006-06-01), Nishi et al.
patent: 7087352 (2006-08-01), Fay et al.
patent: 7126689 (2006-10-01), Nishi
patent: 2002/0001071 (2002-01-01), Nomura et al.
patent: 2002/0008869 (2002-01-01), Van der Laan et al.
patent: 2002/0036758 (2002-03-01), de Mol et al.
patent: 1087264 (1996-01-01), None
Adachi Naoyasu
Noguchi Masayuki
Suzuki Katsuya
Sonnenschein Nath & Rosenthal LLP
Sony Corporation
LandOfFree
Method of manufacturing semiconductor device and apparatus... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing semiconductor device and apparatus..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor device and apparatus... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3735241