Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-07-25
2006-07-25
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S114000
Reexamination Certificate
active
07081374
ABSTRACT:
A semiconductor device manufacturing apparatus includes a pre-alignment section having a pre-alignment camera which is adapted to recognize marks formed on a multi-arrayed substrate, a dicing section which dices the substrate with a cutting blade in accordance with information resulting from image recognition of the marks by the pre-alignment section, and an xy table which carries the substrate. The pre-alignment section recognizes in advance all marks on the substrate based on image recognition thereby to determine the dicing positions, and the dicing section merely recognizes a few points of the substrate with an alignment camera. Consequently, pre-alignment and dicing can take place concurrently, and the throughput of the dicing process can be improved.
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Nguyen Khiem
Renesas Northern Japan Semiconductor, Inc.
Renesas Technology Corp.
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