Method of manufacturing semiconductor device

Details Method of manufacturing semiconductor device Method of manufacturing semiconductor device

1998-11-18

1999-11-30

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438105, 438126, H01L 2144

Patent

active

059941685

ABSTRACT:
A method of manufacturing a semiconductor device which allows reliability of connection to be improved and manufacturing time to be reduced includes sandwiching a sheet-shaped unhardended hardenable material between a semiconductor chip and an interposer or substrate. The hardenable material is then melted, thereby bonding the semiconductor chip and the interposer, the surface of the semiconductor chip opposite the interposer being covered with the hardening resin. The hardenable material is then hardened in an appropriate manner.

REFERENCES:
patent: 5468681 (1995-11-01), Pasch
patent: 5489804 (1996-02-01), Pasch
patent: 5710071 (1998-01-01), Beddingfield et al.
patent: 5863815 (1999-01-01), Egawa

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