Method of manufacturing semiconductor device

Details Method of manufacturing semiconductor device Method of manufacturing semiconductor device

1997-10-08

1999-01-26

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438105, 438126, H01L 2144

Patent

active

058638156

ABSTRACT:
A method of manufacturing a semiconductor device which allows reliability of connection to be improved and manufacturing time to be reduced includes sandwiching a sheet-shaped unhardended hardenable material between a semiconductor chip and an interposer or substrate. The hardenable material is then melted, thereby sealing the semiconductor chip and the interposer, including along connection terminals therebetween. The hardenable material is then hardened in an appropriate manner.

REFERENCES:
patent: 5468681 (1995-11-01), Pasch
patent: 5489804 (1996-02-01), Pasch
patent: 5710071 (1998-01-01), Beddingfield et al.

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