Method of manufacturing semiconductor device

Fishing – trapping – and vermin destroying

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Details

437210, 437214, 437226, 437227, 148DIG28, H01L 2160

Patent

active

055939260

ABSTRACT:
A method of manufacturing a semiconductor device having a package including a base, and a chip mounted on the base, wherein the chip has a surface on which an element is formed, the method comprising the steps of (a) fixing the chip having a protective coat formed on the surface to the base; and (b) removing the protective coat from the chip without touching the chip.

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