Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1998-08-27
2000-12-12
Utech, Benjamin L.
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
710712, 710718, H01L 21302
Patent
active
061598615
ABSTRACT:
In a method of manufacturing a semiconductor device which has a semiconductor substrate, a channel layer formed on the semiconductor substrate and an insulating film deposited on the channel layer, an opening corresponding to a gate electrode pattern is formed in the insulating film by the use of a photoresist film. The channel layer contains crystal components while the photo-resist film contains carbon. The insulating film is etched to exposed said channel layer after removing the photoresist film. In consequence, no reacted production is formed between the crystal components and the carbon on the exposed channel layer.
REFERENCES:
patent: 4324038 (1982-04-01), Chang et al.
patent: 4689115 (1987-08-01), Ibbotson et al.
patent: 4902377 (1990-02-01), Berglumd et al.
patent: 4943344 (1990-07-01), Tachi et al.
patent: 5512500 (1996-04-01), Oyamausu
patent: 5514621 (1996-05-01), Tabara
patent: 5541127 (1996-07-01), Hoshiko et al.
patent: 5705414 (1998-01-01), Lustig
patent: 5744402 (1998-04-01), Fukazawa et al.
patent: 5766988 (1998-06-01), Cho et al.
patent: 5767006 (1998-06-01), Lee
patent: 5841196 (1998-11-01), Gupta et al.
patent: 5849641 (1998-12-01), Arnett et al.
patent: 5851872 (1998-12-01), Chen et al.
patent: 5877092 (1999-03-01), Lee et al.
patent: 5915204 (1999-06-01), Sumi
"Plasma Chemistry in ULSI Age", published by Kogyo Chosakai, pp. 75-93, 1983.
"Semiconductor World," Mar. 1996, pp. 19-24.
Asai Shuji
Oikawa Hirokazu
NEC Corporation
Umez-Eronini Lynette T.
Utech Benjamin L.
LandOfFree
Method of manufacturing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-216515