Method of manufacturing semiconductor device

Details Method of manufacturing semiconductor device Method of manufacturing semiconductor device

2004-10-04

2008-10-21

McPherson, John A. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Radiation mask

C430S311000, C430S312000, C430S313000

Reexamination Certificate

active

07438998

ABSTRACT:
In a method of manufacturing a semiconductor device including a wiring pattern in the form of a linear line having an intermediate portion with a locally different line width, the wiring pattern being formed by using a resist pattern, the resist pattern is formed through an exposure step using a mask pattern prepared by dividing the wiring pattern in a mask into a simple line portion and a rectangular pattern portion having a different line width, and interposing between the line portion and the rectangular pattern portion a slit having a predetermined separation width of not larger than 0.22×λ/NA (λ represents a wavelength of exposure light, and NA represents a numerical aperture of a projection lens).

REFERENCES:
patent: 4837176 (1989-06-01), Zdebel et al.
patent: 5959325 (1999-09-01), Adair et al.
patent: 6598218 (2003-07-01), Lin
patent: 2002/0177078 (2002-11-01), Blatchford et al.
patent: 2004/0161707 (2004-08-01), Hasegawa et al.
patent: 62-141558 (1987-06-01), None
patent: 3-89347 (1991-04-01), None
patent: 7-248612 (1995-09-01), None
patent: 10142769 (1998-05-01), None
patent: 2000-47366 (2000-02-01), None

Affiliated with

Also associated with

Rating

Method of manufacturing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3988735