Method of manufacturing semiconductor device

Details Method of manufacturing semiconductor device Method of manufacturing semiconductor device

2007-10-23

2007-10-23

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S112000, C438S127000, C257SE21502, C257SE21506

Reexamination Certificate

active

11003361

ABSTRACT:
A semiconductor device which includes: a semiconductor chip with plural pads; a tab connected with the semiconductor chip; bus bars which are located outside of the semiconductor chip and connected with the tab; a sealing body which resin-seals the semiconductor chip; plural leads arranged in a line around the semiconductor chip; plural first wires which connect pads of the semiconductor chip and the leads; and plural second wires which connect specific pads of the semiconductor chip and the bus bars. Since the sealing body has a continuous portion which continues from a side surface of the semiconductor chip to its back surface to a side surface of the tab, the degree of adhesion among the semiconductor chip, the tab and the sealing body is increased. This prevents peeling between the tab and the sealing body during a high-temperature process and thus improves the quality of the semiconductor device (QFN).

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